Sensor unit, display device including the same, and method for measuring moisture using the same

ABSTRACT

A sensor unit including driving electrodes and sensing electrodes, driving lines connected to the driving electrodes, sensing lines connected to the sensing electrodes, a driving signal output unit configured to sequentially apply driving signals to every P driving lines in a first driving mode, and a detector configured to receive detection signals from every Q sensing lines in the first driving mode, in which P and Q are positive integers.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2019-0097397, filed on Aug. 9, 2019, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to a sensorunit, a display device including the same, and a method for measuringmoisture using the same.

Discussion of the Background

As the information-oriented society evolves, various demands for displaydevices are increasing. For example, display devices are being employedin a variety of electronic devices, such as smart phones, digitalcameras, laptop computers, navigation devices, and smart televisions.

As display devices are employed in various electronic devices, displaydevices may be equipped with a variety of features. For example, manyskin moisture meters capable of measuring a person's skin moisture haverecently been used. However, since the skin moisture meters include anexposed electrode in contact with a user's skin, it has been difficultto directly apply the skin moisture meters to a display device.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Display devices constructed according to exemplary embodiments of theinvention include a sensor unit capable of measuring a person's skinmoisture.

Exemplary embodiments also provide a display device including a sensorunit capable of measuring skin moisture, and a method of measuringmoisture by the same.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

A sensor unit according to an exemplary embodiment includes drivingelectrodes and sensing electrodes, driving lines connected to thedriving electrodes, sensing lines connected to the sensing electrodes, adriving signal output unit configured to sequentially apply drivingsignals to every P driving lines in a first driving mode, in which P isa positive integer, and a detector configured to receive detectionsignals from every Q sensing lines in the first driving mode, in which Qis a positive integer and the first driving mode is for calculating askin moisture content.

P may be greater than Q.

P may be equal to Q.

In the first driving mode, the driving signal output unit may beconfigured to apply the driving signals simultaneously to each of the Pdriving lines.

In the first driving mode, the driving signal output unit may beconfigured to apply the driving signals sequentially to every P drivinglines for 1 to 1.5 seconds repeatedly.

In the first driving mode, the detector may be configured to convert thedetection signals into digital detection data, and output the digitaldetection data.

In the first driving mode, a frequency of the driving signal may be in arange of about 50 kHz to about 500 kHz.

The driving signal output unit may be configured to apply the drivingsignals sequentially to every R driving lines in a second driving mode,in which R is a positive integer less than P, and the detector may beconfigured to receive the detection signals from S sensing lines in thesecond driving mode, in which S is a positive integer less than Q andthe second driving mode is for detecting a touch.

R may be less than P, and S may be less than Q.

A time period during which the driving signals are sequentially appliedto every P driving lines in the first driving mode may be longer than atime period during which the driving signals are sequentially applied toevery R driving lines in the second driving mode.

A frequency of the driving signal in the first driving mode may bedifferent from a frequency of the driving signal in the second drivingmode.

A frequency of the driving signal in the first driving mode may be equalto a frequency of the driving signal in the second driving mode.

A display device according to another exemplary embodiment includes adisplay panel including a display unit configured to display images, anda sensor unit configured to measure a skin moisture content, the sensorunit including sensor electrodes including driving electrodes andsensing electrodes, driving lines connected to the driving electrodes,sensing lines connected to the sensing electrodes, a driving signaloutput unit configured to sequentially apply driving signals to every Pdriving lines in a first driving mode, wherein P is a positive integer,and a detector configured to receive detection signals from every Qsensing lines in the first driving mode, in which Q is a positiveinteger and the first driving mode is for calculating a skin moisturecontent.

The display device may further include a main processor, in which thedetector may be configured to convert the detection signals into digitaldetection data and output the digital detection data in the firstdriving mode, and the main processor may be configured to calculate askin moisture content based on the digital detection data.

The main processor may be configured to output skin moisture dataincluding skin moisture content information according to the digitaldetection data.

The main processor may be configured to correct the digital detectiondata before calculating the skin moisture content according to thedigital detection data.

The main processor may be configured to correct the digital detectiondata when at least one of a temperature is not in a predeterminedtemperature range and a humidity is not in a predetermined humidityrange.

The corrected digital detection data may have a greater value than thedigital detection data when the temperature is lower than a lower limitof the predetermined temperature range, and the corrected digitaldetection data may have a lower value than the digital detection datawhen the temperature is higher than an upper limit of the predeterminedtemperature range.

The main processor may be configured to increase the digital detectiondata when a protective film is disposed on the display panel.

The main processor may be configured to increase the digital detectiondata when the display panel is determined as being stationary.

A method of measuring moisture by a sensor unit according to anotherexemplary embodiment includes the steps of sequentially applying drivingsignals to every P driving lines, and receiving detection signals fromevery Q sensing lines, in which P and Q are positive integers,converting the detection signals into digital detection data, andcalculating a skin moisture content based on the digital detection data,in which the skin moisture content increases as the digital detectiondata decreases.

The steps may further include correcting the digital detection data whenat least one of a temperature is not in a predetermined temperaturerange and a humidity does is not in a predetermined humidity range.

The digital detection data may be corrected to have a greater value whenthe temperature is lower than a lower limit of the predeterminedtemperature range, and the digital detection data may be corrected tohave a lower value when the temperature is higher than an upper limit ofthe predetermined temperature range.

The steps may further include increasing the digital detection data whena protective film is disposed on a display panel.

The steps may further include increasing the digital detection data ifit is determined that a display panel is supported by a ground mass,such as a ground and an object.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view of a display device according to anexemplary embodiment.

FIG. 2 is an exploded, perspective view of a display device according toan exemplary embodiment.

FIG. 3 is a plan view showing a display panel according to an exemplaryembodiment.

FIGS. 4 and 5 are cross-sectional views showing a display deviceaccording to an exemplary embodiment.

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 2.

FIG. 7 is a plan view of the display unit of FIG. 5 according to anexemplary embodiment.

FIG. 8 is a plan view of the sensor unit of FIG. 5 according to anexemplary embodiment.

FIG. 9 is a block diagram showing the sensor unit of FIG. 8.

FIG. 10 is a diagram of a first driving electrode, a first sensingelectrode, a driving signal output unit, and a detector for mutualcapacitance sensing according to an exemplary embodiment.

FIG. 11 is an enlarged plan view of area A of FIG. 8 according to anexemplary embodiment.

FIG. 12 is an enlarged plan view of area A-1 of FIG. 11 according to anexemplary embodiment.

FIG. 13 is a cross-sectional view taken along line II-II′ of FIG. 12.

FIG. 14 is a flowchart for illustrating a touch sensing scheme by asensor unit in a second driving mode according to an exemplaryembodiment.

FIG. 15 is a view illustrating driving signals applied to driving linesin a second driving mode according to an exemplary embodiment.

FIG. 16 is a flowchart for illustrating a touch sensing scheme by asensor unit in a first driving mode according to an exemplaryembodiment.

FIG. 17 is a view illustrating driving signals applied to driving linesin a first driving mode according to an exemplary embodiment.

FIG. 18 is a graph showing the amount of change in the total mutualcapacitance according to the frequency of the driving signal in thefirst driving mode.

FIG. 19 is a graph showing the amounts of change in the total mutualcapacitances over time for different experimenters in the first drivingmode.

FIG. 20 is a graph showing skin moisture content versus capacitance oftotal mutual capacitance.

FIG. 21 is an exemplary view of a human skin structure.

FIG. 22 is an enlarged view of the stratum corneum shown in FIG. 21.

FIG. 23 is a flowchart for illustrating a touch sensing scheme by asensor unit in a first driving mode according to an exemplaryembodiment.

FIG. 24 is a flowchart illustrating step S303 of FIG. 23 according to anexemplary embodiment.

FIG. 25 is a flowchart illustrating step S303 of FIG. 23 according toanother exemplary embodiment.

FIG. 26 is a flowchart illustrating step S303 of FIG. 23 according tostill another exemplary embodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z—axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

As customary in the field, some exemplary embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the scope of the inventive concepts. Further, theblocks, units, and/or modules of some exemplary embodiments may bephysically combined into more complex blocks, units, and/or moduleswithout departing from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view of a display device according to anexemplary embodiment. FIG. 2 is an exploded, perspective view of adisplay device according to an exemplary embodiment.

Referring to FIGS. 1 to 2, a display device 10 according to an exemplaryembodiment may display moving images or still images. The display device1 may be used as a display screen of portable electronic devices, suchas a mobile phone, a smart phone, a tablet PC, a smart watch, a watchphone, a mobile communications terminal, an electronic notebook, anelectronic book, a portable multimedia player (PMP), a navigation deviceand a ultra mobile PC (UMPC), as well as a display screen of variousproducts, such as a television, a notebook, a monitor, a billboard, andthe Internet of Things.

The display device 10 according to an exemplary embodiment includes acover window 100, a display panel 300, a display circuit board 310, adisplay driving circuit 320, a sensor driver 330, a bracket 600, a maincircuit board 700, a battery 790, and a bottom cover 900.

As used herein, the term “upper side” refers to the side of the displaypanel 300 in the z-axis direction where the cover window 100 isdisposed, whereas the term “lower side” refers to the opposite side ofthe display panel 300 in the z-axis direction where the bracket 600disposed. As used herein, the terms “left,” “right,” “upper” and “lower”sides indicate relative positions when the display panel 300 is viewedfrom the top. For example, the “left side” refers to the oppositedirection indicated by the arrow of the x-axis, the “right side” refersto the direction indicated by the arrow of the x-axis, the “upper side”refers to the direction indicated by the arrow of the z-axis, and the“lower side” refers to the opposite direction indicated by the arrow ofthe z-axis.

The display device 10 may have substantially a rectangular shape whenviewed from the top. For example, the display device 10 may havesubstantially a rectangular shape having shorter sides in a firstdirection (e.g., x-axis direction) and longer sides in a seconddirection (e.g., y-axis direction) when viewed from the top, as shown inFIGS. 1 and 2. Each of the corners where the short side in the firstdirection (e.g., x-axis direction) meets the longer side in the seconddirection (e.g., y-axis direction) may be rounded with a predeterminedcurvature or may be a right angle. However, the inventive concepts arenot limited to a particular shape of the display device 10 when viewedfrom the top, and in some exemplary embodiments, the display device mayhave another polygonal shape, circular shape, or elliptical shape.

The display device 10 may include a first area DR1 which is formed flat,and a second area DR2 extended from the right and left sides of thefirst area DR1. The second area DR2 may be formed flat or may be curved.When the second area DR2 is formed flat, the angle formed by the firstarea DR1 and the second area DR2 may be an obtuse angle. When the secondarea DR2 is formed as a curved surface, the surface may have a constantcurvature or a varying curvature.

Although the second areas DR2 are described as being extended from theleft and right sides of the first area DR1 in FIG. 1, however, theinventive concepts are not limited thereto. In particular, the secondarea DR2 may be extended from only one of the right and left sides ofthe first area DR1. Alternatively, the second area DR2 may be extendedfrom at least one of upper and lower sides of the first area DR1, aswell as the left and right sides. Hereinafter, the second areas DR2 willbe described as being disposed at the left and right edges of thedisplay device 10, respectively, according to an exemplary embodiment.

The cover window 100 may be disposed on the display panel 300 to coverthe upper surface of the display panel 300. Thus, the cover window 100can protect the upper surface of the display panel 300.

The cover window 100 may include a transmissive portion DA100corresponding to the display panel 300, and a non-transmissive portionNDA100 corresponding to the areas other than the display panel 300. Thecover window 100 may be disposed in the first region DR1 and the secondregions DR2. The transmissive portion DA100 may be disposed in a part ofthe first region DR1 and a part of each of the second regions DR2. Thenon-transmissive portion NDA100 may be opaque. Alternatively, thenon-transmissive portion NDA100 may be formed as a decoration layerhaving a pattern that can be displayed to the user when no image isdisplayed.

The display panel 300 may be disposed under the cover window 100. Thedisplay panel 300 may be disposed to overlap the transmissive portionDA100 of the cover window 100. The display panel 300 may be disposed inthe first area DR1 and the second areas DR2. Therefore, the image on thedisplay panel 300 can be seen not only in the first area DR1 but also inthe second areas DR2.

The display panel 300 may be a light-emitting display panel includinglight-emitting elements. For example, the display panel 300 may be anorganic light-emitting display panel using organic light-emitting diodesincluding organic emissive layer, a micro light-emitting diode displaypanel using micro LEDs, a quantum-dot light-emitting display panelincluding quantum-dot light-emitting diodes including an quantum-dotemissive layer, or an inorganic light-emitting display panel usinginorganic light-emitting elements including an inorganic semiconductor.Hereinafter, the display panel 300 will be described with reference toan organic light-emitting display panel according to an exemplaryembodiment.

The display circuit board 310 and the display driving circuit 320 may beattached to one side of the display panel 300. One side of the displaycircuit board 310 may be attached to pads disposed on one side of thedisplay panel 300 using an anisotropic conductive film or the like. Thedisplay circuit board 310 may be a flexible printed circuit board (FPCB)that can be bent, a rigid printed circuit board (PCB) that is rigid andnot bendable, or a hybrid printed circuit board including a rigidprinted circuit board and a flexible printed circuit board.

The display driving circuit 320 receives control signals and supplyvoltages through the display circuit board 310, and outputs signals andvoltages for driving the display panel 300. The display driving circuit320 may be implemented as an integrated circuit (IC). The displaydriving circuit 320 may be disposed on the display panel 300. Forexample, the display driving circuit 320 may be attached to the displaypanel 300 by a chip on glass (COG) technique, a chip on plastic (COP)technique, or an ultrasonic bonding. Alternatively, the display drivingcircuit 320 may be disposed on the display circuit board 310.

The sensor driver 330 may be disposed on the display circuit board 310.The sensor driver 330 may be implemented as an integrated circuit. Thesensor driver 330 may be attached on the display circuit board 310. Thesensor driver 330 may be electrically connected to sensor electrodes ofa sensor electrode layer of the display panel 300 through the displaycircuit board 310. The sensor driver 330 may apply driving signals todriving electrodes among the sensor electrodes, and sense amounts ofchange in mutual capacitance between the driving electrodes and thesensing electrodes (hereinafter, referred to as “mutual capacitance”)through sensing electrodes among the sensor electrodes. In this manner,it is possible to determine whether a user touches the display panel, aswell as measuring the user's skin moisture. The user's touch may includea physical contact and a near proximity. A user's physical contactrefers to when an object, such as the user's finger or a pen, is broughtinto contact with the cover window 100 of the display device 10 disposedon the sensor electrode layer. The near proximity refers to when anobject, such as the user's finger or a pen, is close to but is spacedapart from a surface of the display device 10, such as hovering over thedisplay device 10.

On the display circuit board 310, a power supply for supplying drivingvoltages for driving the pixels P, the scan driver 340, and the displaydriving circuit 320 of the display panel 300 may be further disposed.Alternatively, the power supply may be integrated with the displaydriving circuit 320, in which case, the display driving circuit 320 andthe power supply may be implemented as a single integrated circuit.

The bracket 600 may be disposed under the display panel 300. The bracket600 may include plastic, metal, or both of plastic and metal. In thebracket 600, a first camera hole CMH1, in which a camera device 720 isinserted, a battery hole BH, in which a battery is disposed, and a cablehole CAH, through which a cable 314 connected to the display circuitboard 310, passes may be formed.

The main circuit board 700 and the battery 790 may be disposed under thebracket 600. The main circuit board 700 may be either a printed circuitboard or a flexible printed circuit board.

The main circuit board 700 may include a main processor 710, a cameradevice 720, a main connector 730, an acceleration sensor 740, a gyrosensor 750, etc. The main processor 710, the acceleration sensor 740,and the gyro sensor 750 may be implemented as integrated circuits. Insome exemplary embodiments, the acceleration sensor 740 and the gyrosensor 750 may be implemented as a single integrated circuit.

The camera device 720 may be disposed on both the upper and lowersurfaces of the main circuit board 700. The main processor 710, theacceleration sensor 740, and the gyro sensor 750 may be disposed on theupper surface of the main circuit board 700, and the main connector 730may be disposed on the lower surface of the main circuit board 700.

The main processor 710 may control the functions of the display device10. For example, the main processor 710 may output digital video data tothe display driving circuit 320 through the display circuit board 310,so that the display panel 300 displays images. In addition, the mainprocessor 710 receives detection data from the sensor driver 330. Themain processor 710 may determine whether there is a user's touch basedon the detection data in a touch sensing mode, and may execute anoperation associated with the user's physical contact or near proximity.For example, the main processor 710 may calculate the user's touchcoordinates by analyzing the detection data in the touch sensing mode,and then may run an application indicated by an icon touched by the useror perform the operation. The main processor 710 may calculate theuser's skin moisture by analyzing the detection data in a moisturemeasuring mode.

Hereinafter, the moisture measuring mode may also be referred to as afirst driving mode, and the touch sensing mode may also be referred toas a second driving mode.

The main processor 710 may be an application processor, a centralprocessing unit, or a system chip implemented as an integrated circuit.

The camera device 720 processes image frames, such as still image andvideo obtained by the image sensor in the camera mode, and outputs themto the main processor 710.

The cable 314 having passed through the cable hole CAH of the bracket 60may be connected to main connector 730. Therefore, the main circuitboard 700 may be electrically connected to the display circuit board310.

The acceleration sensor 740 may detect acceleration in the firstdirection (e.g., x-axis direction), the second direction (e.g., y-axisdirection), and the third direction (e.g., z-axis direction). Theacceleration sensor 740 may output acceleration data includingacceleration information in the first direction (e.g., x-axisdirection), the second direction (e.g., y-axis direction), and the thirddirection (e.g., z-axis direction) to the main processor 710.

The gyro sensor 750 may detect angular velocity in the first direction(e.g., x-axis direction), the second direction (e.g., y-axis direction),and the third direction (e.g., z-axis direction). The gyro sensor 750may output angular velocity data including angular velocity informationin the first direction (e.g., x-axis direction), the second direction(e.g., y-axis direction), and the third direction (e.g., z-axisdirection) to the main processor 710.

The main processor 710 may determine the inclination of the displaydevice 10 and the rotation direction of the display device 10 based onthe acceleration data from the acceleration sensor 740 and the angularvelocity data from the gyro sensor 750. As such, the main processor 710can determine whether the display device 10 is stationary based on theacceleration data and the angular velocity data.

The battery 790 may be disposed so as not to overlap the main circuitboard 700 in the third direction (e.g., z-axis direction). The battery790 may overlap with the battery hole BH of the bracket 600.

In some exemplary embodiments, a mobile communications module capable oftransmitting/receiving a radio signal to/from at least one of a basestation, an external terminal, and a server over a mobile communicationsnetwork may be further mounted on the main circuit board 700. Thewireless signal may include various types of data depending on a voicesignal, a video call signal, or a text/multimedia messagetransmission/reception.

The bottom cover 900 may be disposed under the main circuit board 700and the battery 790. The bottom cover 900 may be fastened and fixed tothe bracket 600. The bottom cover 900 may form the exterior of the lowersurface of the display device 10. The bottom cover 900 may includeplastic, metal, or plastic and metal.

A second camera hole CMH2 may be formed in the bottom cover 900, throughwhich the lower surface of the camera device 720 is exposed. Thepositions of the camera device 720 and the first and second camera holesCMH1 and CMH2 in line with the camera device 720 are not limited tothose shown in FIG. 2.

FIG. 3 is a plan view of a display panel according to an exemplaryembodiment. FIGS. 4 and 5 are cross-sectional views of a display deviceaccording to an exemplary embodiment.

Referring to FIGS. 3 to 5, the display panel 300 according to anexemplary embodiment may be one of an organic light-emitting displaypanel, a liquid-crystal display panel, a plasma display panel, a fieldemission display panel, an electrophoretic display panel, anelectrowetting display panel, and a quantum-dot light-emitting displaypanel, an inorganic light-emitting display panel, and a micro LEDdisplay device. Hereinafter, the display panel 300 will be describedwith reference to an organic light-emitting display device. However, theinventive concepts are not limited thereto.

The display panel 300 may include a main area MA and a protruding areaPA protruding from one side of the main area MA.

The main area MA may be formed in a rectangular plane having shortersides in a first direction (e.g., x-axis direction) and longer sides ina second direction (e.g., y-axis direction) intersecting the firstdirection (e.g., x-axis direction). Each of the corners where the shortside in the first direction (e.g., x-axis direction) meets the longerside in the second direction (e.g., y-axis direction) may be roundedwith a predetermined curvature or may be a right angle. The shape of thedisplay device 10 when viewed from the top is not limited to aquadrangular shape, but may be formed in another polygonal shape,circular shape, or elliptical shape in some exemplary embodiments. Themain area MA may be, but is not limited to, formed to be flat. The mainarea MA may include curved portions formed at left and right endsthereof. The curved portions may have a constant curvature or varyingcurvatures.

The main area MA may include a display area DA where pixels are formedto display images, and a non-display area NDA around the display areaDA.

In addition to the pixels, scan lines, data lines, and power linesconnected to the pixels may be disposed in the display area DA. When themain area MA includes a curved portion, the display area DA may bedisposed on the curved portion. In this case, images of the displaypanel 300 can also be seen on the curved portion.

The non-display area NDA may be defined as the area from the outer sideof the display area DA to the edge of the display panel 300. In thenon-display area NDA, a scan driver for applying scan signals to scanlines, and link lines connecting the data lines with the display drivingcircuit 320 may be disposed.

The protruding area PA may protrude from one side of the main area MA.For example, the protruding area PA may protrude from the lower side ofthe main area MA as shown in FIG. 3. The length of the protruding areaPA in the first direction (e.g., x-axis direction) may be less than thelength of the main area MA in the first direction (e.g., x-axisdirection).

The protruding area PA may include a bending area BA and a pad area PDA.In this case, the pad area PDA may be disposed on one side of thebending area BA, and the main area MA may be disposed on the oppositeside of the bending area BA. For example, the pad area PDA may bedisposed on the lower side of the bending area BA, and the main area MAmay be disposed on the upper side of the bending area BA.

The display panel 300 may be formed to be flexible so as to be curved,bent, folded or rolled. As such, the display panel 300 may be bent atthe bending area BA in the thickness direction. As shown in FIG. 4, onesurface of the pad area PDA of the display panel 300 may face upwardbefore the display panel 300 is bent. As shown in FIG. 5, the surface ofthe pad area PDA of the display panel 300 may face downward after thedisplay panel 300 is bent. In this case, since the pad area PDA isdisposed under the main area MA, the pad area PDA may overlap the mainarea MA.

Pads electrically connected to the display driving circuit 320 and thedisplay circuit board 310 may be disposed in the pad area PDA of thedisplay panel 300.

A cover panel sheet 301 may be disposed under the display panel 300. Thecover panel sheet 301 may be attached to the lower surface of thedisplay panel 300 by an adhesive member, or the like. The adhesivemember may be a pressure-sensitive adhesive (PSA).

The cover panel sheet 301 may include a light-absorbing member forabsorbing light incident from outside, a buffer member for absorbingexternal impact, and a heat dissipating member for efficientlydischarging heat from the display panel 300.

The light-absorbing member may be disposed under the display panel 300.The light-absorbing member blocks the transmission of light to preventthe elements disposed thereunder from being seen from above the displaypanel 300, such as the display circuit board 310. The light-absorbingmember may include a light-absorbing material, such as a black pigmentand a black dye.

The buffer member may be disposed under the light-absorbing member. Thebuffer member absorbs an external impact to prevent the display panel300 from being damaged. The buffer member may have a single layer ormultiple layers structure. For example, the buffer member may be formedof a polymer resin, such as polyurethane, polycarbonate, polypropyleneand polyethylene, or may be formed of a material having elasticity, suchas a rubber and a sponge obtained by foaming a urethane-based materialor an acrylic-based material. The buffer member may be a cushion layer.

The heat dissipating member may be disposed under the buffer member. Theheat-dissipating member may include a first heat dissipation layerincluding graphite or carbon nanotubes, and a second heat dissipationlayer formed of a thin metal film, such as copper, nickel, ferrite, andsilver, which can block electromagnetic waves and have high thermalconductivity.

In order to easily bend the display panel 300, the cover panel sheet 301may not be disposed in the bending area BA of the display panel 300 asshown in FIG. 4. Since the display panel 300 is bent in the bending areaBA such that the pad area PDA is disposed under the main area MA, thedisplay panel 300 may overlap the main area MA. Accordingly, the coverpanel sheet 301 disposed in the main area MA of the display panel 300and the cover panel sheet 301 disposed in the pad area PDA of thedisplay panel 300 may be attached together by an adhesive member 302.The adhesive member 302 may be a pressure-sensitive adhesive.

The display driving circuit 320 outputs signals and voltages for drivingthe display panel 300. For example, the display driving circuit 320 mayapply data voltages to the data lines. In addition, the display drivingcircuit 320 may apply supply voltage to the power line, and may applyscan control signals to the scan driver. The display driving circuit 320may be implemented as an integrated circuit (IC), and may be attached tothe display panel 300 in a pad area PDA by a chip on glass (COG)technique, a chip on plastic (COP) technique, or an ultrasonic bonding.For example, the display driving circuit 320 may be mounted on thedisplay circuit board 310.

Pads may include display pads electrically connected to the displaydriving circuit 320 and sensor pads electrically connected to sensorlines.

The display circuit board 310 may be attached on the pads using ananisotropic conductive film or the like. In this manner, the lead linesof the display circuit board 310 may be electrically connected to thepads. The display circuit board 310 may be a flexible printed circuitboard, a printed circuit board, or a flexible film, such as a chip onfilm.

The sensor driver 330 may be connected to the sensor electrodes of thesensor electrode layer SEL of the display panel 300. The sensor driver330 applies driving signals to the sensor electrodes of the sensorelectrode layer SEL, and measures mutual capacitances of the sensorelectrodes. The driving signals may have driving pulses. The sensordriver 330 can determine whether there is a user's touch or nearbyproximity based on the mutual capacitances. As described above, a user'stouch may refer to when an object, such as the user's finger or a pen,brought into contact with a surface of the display device 10 disposed onthe sensor electrode layer SEL, and the user's near proximity may referto when an object, such as the user's finger and a pen, is hovering overa surface of the display device 10.

The sensor driver 330 may be disposed on the display circuit board 310.The sensor driver 330 may be implemented as an integrated circuit (IC)and may be mounted on the display circuit board 310.

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 2.Referring to FIG. 6, the display panel 300 may include a display unit DUand a second unit SU. The display unit DU may have a substrate SUB, athin-film transistor layer TFTL disposed on the substrate SUB, anemission material layer EML, and a thin-film encapsulation layer TFEL.The sensor unit SU may have a sensor electrode layer SEL.

The substrate SUB may be made of an insulating material, such as glass,quartz, and a polymer resin. The polymer material may includepolyethersulphone (PES), polyacrylate (PA), polyacrylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate,polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT),cellulose acetate propionate (CAP), or a combination thereof.Alternatively, the substrate SUB may include a metallic material.

The substrate SUB may be a rigid substrate or a flexible substrate thatcan be bent, folded, rolled, and so on. When the substrate SUB is aflexible substrate, the substrate may include polyimide (PI), withoutbeing limited thereto.

The thin-film transistor layer TFTL may be disposed on the substrateSUB. On the thin-film transistor layer TFTL, scan lines, data lines,power supply lines, scan control lines, routing lines connecting thepads with the data lines may be formed, as well as thin-film transistorsin the pixels. Each of the thin-film transistors may include a gateelectrode, a semiconductor layer, a source electrode, and a drainelectrode. When the scan driver 340 is formed in the non-display areaNDA of the display panel 300 as shown in FIG. 7, the scan driver 340 mayinclude thin-film transistors.

The thin-film transistor layer TFTL may be disposed in the display areaDA and the non-display area NDA. More particularly, the thin-filmtransistors in the pixels, the scan lines, the data lines, and the powersupply lines on the thin-film film transistor layer TFTL may be disposedin the display area DA. The scan control lines and the link lines on thethin-film transistor layer TFTL may be disposed in the non-display areaNDA.

The emission material layer EML may be disposed on the thin-filmtransistor layer TFTL. The light-emitting element layer EML may includepixels including a first electrode, an emissive layer, a secondelectrode, and a pixel-defining layer. The emissive layer may be anorganic emissive layer including an organic material. The emissive layermay include a hole transporting layer, an organic light-emitting layer,and an electron transporting layer. When a voltage is applied to thefirst electrode, and a cathode voltage is applied to the secondelectrode through the thin-film transistor disposed on the thin-filmtransistor layer TFTL, the holes and electrons move to the organiclight-emitting layer through the hole transporting layer and theelectron transporting layer, respectively, and be combined in theorganic light-emitting layer to emit light. The pixels on thelight-emitting element layer EML may be disposed in the display area DA.

The thin-film encapsulation layer TFEL may be disposed on thelight-emitting element layer EML. The thin-film encapsulation layer TFELmay prevent oxygen or moisture from permeating into the light-emittingelement layer EML. As such, the thin-film encapsulation layer TFEL mayinclude at least one inorganic layer. The inorganic layer may be, butnot limited to, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.In addition, the thin-film encapsulation layer TFEL protects thelight-emitting element layer EML from foreign substances, such as dust.To this end, the thin-film encapsulation layer TFEL may include at leastone organic layer. The organic layer may be formed of, but is notlimited to, an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin, and a polyimide resin.

The thin-film encapsulation layer TFEL may be disposed in the displayarea DA as well as the non-display area NDA. More particularly, thethin-film encapsulation layer TFEL may cover the display area DA and theemission material layer EML, and may cover the thin-film transistorlayer TFTL in the non-display area NDA.

The sensor electrode layer SEL may be disposed on the thin-filmencapsulation layer TFEL. As the sensor electrode layer SEL is disposeddirectly on the thin-film encapsulation layer TFEL, the thickness of thedisplay device 10 can be reduced, as compared with when the sensorelectrode layer SEL is disposed on a separate touch panel to be attachedon the thin-film encapsulation layer TFEL.

The sensor electrode layer SEL may include sensor electrodes forcapacitive sensing, and sensor lines connecting the sensor pads with thesensor electrodes. The sensor electrodes of the sensor electrode layerSEL may be disposed in a sensor area TSA overlapping the display areaDA, as shown in FIG. 8. The sensor electrodes of the sensor electrodelayer SEL may be disposed in a sensor peripheral area TPA overlappingthe non-display area NDA, as shown in FIG. 8.

A polarizing film may be disposed on the sensor electrode layer SEL. Thepolarizing film may include a linear polarizer and a phase retardationfilm, such as a λ/4 (quarter-wave) plate. In this case, the phaseretardation film may be disposed on the sensor electrode layer SEL, andthe linear polarizer may be disposed on the phase retardation film. Inaddition, a cover window may be disposed on the polarizing film. Thecover window may be attached onto the polarizing film by a transparentadhesive member, such as an optically clear adhesive (OCA) film.

FIG. 7 is a plan view of the display unit of FIG. 6 according to anexemplary embodiment.

FIG. 7 exemplarily shows only pixels P, scan lines SL, data lines DL,scan control lines SCL, fan-out lines DLL, a scan driver 340, a displaydriving circuit 320, and display pads DP of the display unit DU.

Referring to FIG. 7, the scan lines SL, the data lines DL, and thepixels P are disposed in the display area DA. The scan lines SL may bearranged in the first direction (e.g., x-axis direction), while the datalines DL may be arranged in the second direction (e.g., y-axisdirection) intersecting the first direction (e.g., x-axis direction).

Each of the pixels P may be connected to at least one of the scan linesSL and at least one of the data lines DL. Each of the pixels P mayinclude thin-film transistors including a driving transistor and atleast one switching transistor, a light-emitting element, and acapacitor. When a scan signal is applied from a scan line SL, each ofthe pixels P receives a data voltage of a data line DL, and supplies adriving current to the light-emitting element according to the datavoltage applied to the gate electrode to cause emission of light.Although the light-emitting element is described with reference to anorganic light-emitting element including a first electrode, an organicemitting layer, and a second electrode, however, the inventive conceptsare not limited thereto. For example, in some exemplary embodiments, thelight-emitting element may be implemented as a quantum-dotlight-emitting element including a first electrode, a quantum-dotemitting layer, and a second electrode, as an inorganic light-emittingelement including a first electrode, an inorganic emitting layer havingan inorganic semiconductor, and a second electrode, or a microlight-emitting element including a micro light-emitting diode.

The scan driver 340 is connected to the display driving circuit 320through a plurality of scan control lines SCL. Accordingly, the scandriver 340 may receive the scan control signal of the display drivingcircuit 320. The scan driver 340 generates scan signals according to ascan control signal, and supplies the scan signals to the scan lines SL.

Although the scan driver 340 is illustrated as being formed in thenon-display area NDA on the left side of the display area DA as shown inFIG. 5, however, the inventive concepts are not limited thereto. Forexample, in some exemplary embodiments, the scan driver 340 may beformed in the non-display area NDA on the left side as well as in thenon-display area NDA on the right side of the display area DA.

The display driving circuit 320 is connected to the display pads DP andreceives digital video data and timing signals. The display drivingcircuit 320 converts the digital video data into analogpositive/negative data voltages, and supplies the analogpositive/negative data voltages to the data lines DL through the fan-outlines DLL. In addition, the display driving circuit 320 generates andsupplies a scan control signal for controlling the scan driver 340through the scan control lines SCL. The pixels P to which the datavoltages are supplied are selected by the scan signals of the scandriver 340, and the data voltages are supplied to the selected pixels P.The display driving circuit 320 may be implemented as an integratedcircuit (IC) and may be attached to the substrate SUB by a chip on glass(COG) technique, a chip on plastic (COP) technique, or an ultrasonicbonding. However, the inventive concepts are not limited thereto. Forexample, in some exemplary embodiments, the display driving circuit 320may be mounted on the display circuit board 310.

As shown in FIG. 7, the display panel 300 may include display pads DPelectrically connected to the display driving circuit 320, and sensorpads TP1 and TP2 electrically connected to the sensor lines. A displaypad area DPA, in which the display pads DP are disposed, may be disposedbetween a first sensor pad area TPA1 in which the first sensor pads TP1are disposed and a second sensor pad area TPA2 in which the secondsensor pads TP2 are disposed. As shown in FIG. 7, the display pad areaDPA may be disposed at the center of one end of the protruding area PA,the first sensor pad area TPA1 may be disposed at the left side of theend of the protruding area PA, and the second sensor pad area TPA2 maybe disposed on the right side of the end of the protruding area PA.

The display circuit board 310 may be attached on the display pads DP andthe sensor pads TP1 and TP2 using an anisotropic conductive film or thelike. Accordingly, the lead lines of the display circuit board 310 maybe electrically connected to the display pads DP and the sensor pads TP1and TP2. The display circuit board 310 may be a flexible printed circuitboard, a printed circuit board, or a flexible film, such as a chip onfilm.

The sensor driver 330 may be connected to the sensor electrodes of thesensor unit of the display panel 300. The sensor driver 330 appliesdriving signals to the sensor electrodes, and senses mutual capacitancesof the sensor electrodes. The driving signals may have driving pulses.The sensor driver 330 may be disposed on the display circuit board 310.The sensor driver 330 may be implemented as an integrated circuit, andmay be mounted on the display circuit board 310.

FIG. 8 is a plan view showing the sensor unit of FIG. 5 according to anexemplary embodiment.

Referring to FIG. 8, the sensor electrodes of the sensor unit SUaccording to an exemplary embodiment include the two kinds ofelectrodes, e.g., the driving electrodes TE and the sensing electrodesRE connected through the connection portions BE1. The sensor unit SU maybe formed as two layers and perform capacitive sensing by applying thedriving signals to the driving electrodes TE and then sensing theamounts of change in mutual capacitances through the sensing electrodesRE. However, the inventive concepts are not limited thereto. Forexample, in some exemplary embodiments, the sensor electrodes TE and REof the sensor unit SU may include the driving electrodes TE and thesensing electrodes RE without the connection portions BE1, and may beformed as one layer for capacitive sensing. Alternatively, the sensorunit SU may be driven in one layer for self-capacitance sensing thatsenses amounts of change in self-capacitances using one kind ofelectrodes.

FIG. 8 exemplarily shows only sensor electrodes TE and RE, conductivepatterns DE, sensor lines TL and RL, sensor pads TP1 and TP2, guardlines GL1 to GL5, and ground lines GRL1 to GRL3.

Referring to FIG. 8, the sensor unit SU includes a sensor area TSA forsensing a user's touch, and a sensor peripheral area TPA disposed aroundthe sensor area TSA. The sensor area TSA may overlap the display area DAof the display panel 300, and the sensor peripheral area TPA may overlapthe non-display area NDA of the display unit DU.

The sensor electrodes TE and RE may include first sensor electrodes TEand second sensor electrodes RE. In the illustrated exemplary embodimentshown in FIG. 8, the first sensor electrode is the driving electrode TE,and the second sensor electrode is the sensing electrode RE. In FIG. 8,the driving electrodes TE, the sensing electrodes RE, and the conductivepatterns DE each have a diamond shape when viewed from the top, but theinventive concepts are not limited thereto.

The sensing electrodes RE may be arranged in the first direction (e.g.,x-axis direction) and electrically connected to one another. The drivingelectrodes TE may be arranged in the second direction (e.g., y-axisdirection) crossing the first direction (e.g., x-axis direction) and maybe electrically connected to one another. The driving electrodes TE maybe electrically separated from the sensing electrodes RE. The drivingelectrodes TE may be spaced apart from the sensing electrodes RE. Thedriving electrodes TE may be arranged in parallel in the seconddirection (e.g., y-axis direction). In order to electrically separatethe sensing electrodes RE from the driving electrodes TE at theirintersections, the driving electrodes TE adjacent to each other in thesecond direction (e.g., y-axis direction) may be connected through thefirst connection portion BE1, and the sensing electrodes RE adjacent toeach other in the first direction (e.g., x-axis direction) may beconnected through second connection portion BE2.

The conductive patterns DE may be electrically separated from thedriving electrodes TE and the sensing electrodes RE. The drivingelectrodes TE, the sensing electrodes RE, and the conductive patterns DEmay be disposed apart from each other. The conductive patterns DE may besurrounded by the driving electrodes TE and the sensing electrodes RE,respectively. The parasitic capacitance between the second electrode ofthe emission material layer EML and the driving electrode TE or thesensing electrode RE may be reduced due to the conductive patterns DE.When the parasitic capacitance is reduced, the mutual capacitancebetween the driving electrode TE and the sensing electrode RE can becharged more quickly. However, as the area of the driving electrode TEand the sensing electrode RE is reduced due to the conductive patternsDE, the mutual capacitance between the driving electrode TE and thesensing electrode RE may be reduced, and may become more affected bynoise. As such, the area of the conductive patterns DE may be determinedin consideration of the trade-off between the parasitic capacitance andthe mutual capacitance.

The sensor lines TL, RL, and PL may be disposed in the sensor peripheralarea TPA. The sensor lines TL and RL may include sensing lines RLconnected to the sensing electrodes RE, and a first group of drivinglines GTL1 and a second group of driving lines GTL2 connected to thedriving electrodes TE.

The sensing electrodes RE disposed on one side of the sensor area TSAmay be connected to the sensing lines RL. For example, some of thesensing electrodes RE electrically connected in the first direction(e.g., x-axis direction) that are disposed at the right end may beconnected to the sensing lines RL, as shown in FIG. 8. The sensing linesRL may be connected to second sensor pads TP2. As such, the sensordriver 330 may be electrically connected to the sensing electrodes RE.

The driving electrodes TE disposed near one side of the sensor area TSAmay be connected to the first group of driving lines GTL1, and thedriving electrodes TE disposed near the other side of the sensor areaTSA may be connected to the second group of driving lines GTL2. Forexample, as shown in FIG. 8, some of the driving electrodes TEelectrically connected to one another in the second direction (e.g.,y-axis direction) on the lowermost side may be connected to the firstgroup of driving line GTL1, while some of the driving electrodes TEdisposed on the uppermost side may be connected to the second group ofdriving line GTL2. The second group of driving lines GTL2 may beconnected to the driving electrodes TE on the upper side of the sensorarea TSA via the left outer side of the sensor area TSA. The first groupof driving lines GTL1 and the second group of driving lines GTL2 may beconnected to the first sensor pads TP1. As such, the sensor driver 330may be electrically connected to the driving electrodes TE.

The first guard line GL1 may be disposed on the outer side of theoutermost one of the sensing lines RL. In addition, the first groundline GRL1 may be disposed on the outer side of the first guard line GL1.As shown in FIG. 8, the first guard line GL1 may be disposed on theright side of the rightmost one of the sensing lines RL, and the firstground line GRL1 may be disposed on the right side of the first guardline GL1.

A second guard line GL2 may be disposed between the innermost one of thesensing lines RL and the rightmost one of the first group of drivinglines GTL1. As shown in FIG. 8, the innermost one of the sensing linesRL may be the leftmost one of the sensing lines RL. In addition, thesecond guard line GL2 may be disposed between the rightmost one of thefirst group of driving lines GTL1 and the second ground line GRL2.

A third guard line GL3 may be disposed between the innermost one of thesensing lines RL and the second ground line GRL2. The second ground lineGRL2 may be connected to the rightmost one of the first sensor pads TP1and the leftmost one of the second sensor pads TP2.

A fourth guard line GL4 may be disposed on the outer side of theoutermost one of the second group of driving lines GTL2. As shown inFIG. 8, the fourth guard line GL4 may be disposed on the left side ofthe leftmost one of the second group of driving lines GTL2.

In addition, the third ground line GRL3 may be disposed on the outerside of the fourth guard line GL4. As shown in FIG. 8, the fourth guardline GL4 may be disposed on the left side and upper side of the leftmostand uppermost one of the second group driving lines GTL2, and the thirdground line GRL3 may be disposed on the left side and upper side of thefourth guard line GL4.

A fifth guard line GL5 may be disposed on the inner side of theinnermost one of the second group of driving lines GTL2. As shown inFIG. 8, the fifth guard line GL5 may be disposed between the rightmostone of the second group of driving lines GTL2 and the sensing electrodesRE.

A ground voltage may be applied to the first ground line GRL1, thesecond ground line GRL2, and the third ground line GRL3. In addition, aground voltage may be applied to the first guard line GL1, the secondguard line GL2, the third guard line GL3, the fourth guard line GL4, andthe fifth guard line GL5.

According to the illustrated exemplary embodiment shown in FIG. 8, thedriving electrodes TE adjacent to each other in the second direction(e.g., y-axis direction) are electrically connected to each other, whilethe driving electrodes TE adjacent to each other the first direction(e.g., x-axis direction) are electrically insulated from each other. Inaddition, the sensing electrodes RE adjacent to each other in the firstdirection (e.g., x-axis direction) are electrically connected to eachother, while the sensing electrodes RE adjacent to each other in thesecond direction (e.g., y-axis direction) are electrically insulatedfrom each other. In this manner, mutual capacitances may be formed atintersections of the driving electrodes TE and the sensing electrodesRE.

In addition, according to the illustrated exemplary embodiment shown inFIG. 8, the first guard line GL1 is disposed between the outermost oneof the sensing lines RL and the first ground line GRL1, so that theinfluence from a change in the voltage of the first ground line GRL1 tothe outermost one of the sensing lines RL may be reduced. The secondguard line GL2 disposed between the innermost one of the sensing linesRL and the outermost one of the first group of driving lines GTL1. Inthis manner, the second guard line GL2 can reduce the influence from achange in the voltage to the innermost one of the sensing lines RL andto the outermost one of the first group of driving lines GTL1. The thirdguard line GL3 is disposed between the innermost one of the sensinglines RL and the second ground line GRL2, so that the influence from achange in the voltage of the second ground line GRL2 to the innermostone of the sensing lines RL may be reduced. The fourth guard line GL4 isdisposed between the outermost one of the second group of driving linesGTL2 and the third ground line GRL3, so that the influence from a changein the voltage of the third ground line GRL3 to the second group ofdriving line GTL2 may be reduced. The fifth guard line GL5 is disposedbetween the innermost one of the second group of driving lines GTL2 andthe sensor electrodes TE and RE to suppress mutual influence between theinnermost one of the second group of driving lines GTL2 and the sensorelectrodes TE and RE.

FIG. 9 is a block diagram of the sensor unit of FIG. 8 according to anexemplary embodiment. FIG. 9 exemplarily shows only the sensor area TSAand the sensor driver 330. The sensor driver 330 may include a drivingsignal output unit 331, a detector 332, and a sensor controller 333.

In addition, in FIGS. 9, 15 and 16, a k^(th) driving line TLk refers toone of the second group of driving lines GTL2 or one of the first groupof driving lines GTL1 connected to the driving electrodes disposed inthe k^(th) column of the sensor area TSA of FIG. 8, where 1≤k≤n. Forexample, in FIGS. 9, 15 and 16, a first driving line TL1 refers to oneof the second group of driving lines GTL2 or one of the first group ofdriving lines GTL1 connected to the driving electrodes disposed in thefirst column of the sensor area TSA of FIG. 8. In FIG. 9, the n^(th)driving line TLn refers to one of the second group of driving lines GTL2or one of the first group of driving lines GTL1 connected to the drivingelectrodes disposed in the n^(th) column of the sensor area TSA of FIG.8. The driving electrodes arranged in the first column of the sensorarea TSA may be the driving electrodes arranged in the leftmost columnof the sensor area TSA, and the driving electrodes arranged in thesecond column of the sensor area TSA may be the driving electrodesarranged in the rightmost column of the sensor area TSA.

Referring to FIG. 9, the driving signal output unit 331 outputs drivingsignals to the driving lines TL1 to TLn under the control of the sensorcontroller 333. The driving signal output unit 331 may select drivinglines to output the driving signals from the driving lines TL1 to TLn,and may output the driving signals to the selected driving lines.

In the second driving mode, the driving signal output unit 331 appliesdriving signals to the first R driving lines, then to the second Rdriving lines, and so on, where R is a positive integer less than P. Themutual capacitance(s) formed at the intersection(s) of the R drivingelectrodes and S sensing electrodes may be defined as a first unitsensor, where S is a positive integer less than Q.

For example, the driving signal output unit 331 may sequentially applydriving signals to the driving lines one-by-one in the second drivingmode, as shown in FIG. 15. The driving signal output unit 331 may applya driving signal to a first driving line TL1, then a driving signal to afirst driving line TL2, then a driving signal to a first driving lineTL3, and then a driving signal to a first driving line TL4. In thiscase, the unit sensor may include one mutual capacitance formed at theintersection of one driving line and one sensing line. One mutualcapacitance formed at the intersection of one driving electrode and onesensing electrode may be defined as a “first unit sensor”.

In this first driving mode, the driving signal output unit 331 appliesdriving signals to the first P driving lines, then to the second Pdriving lines, and so on, where P is a positive integer. The mutualcapacitance(s) formed at the intersection(s) of the P driving electrodesand Q sensing electrodes may be defined as a second unit sensor. P mayor may not be equal to Q.

For example, the driving signal output unit 331 may sequentially applydriving signals to the driving lines two-by-two in the first drivingmode, as shown in FIG. 17. The driving signal output unit 331 may applya driving signal to the first driving line TL1 and the second drivingline TL2 simultaneously, and then may apply a driving signal to thethird driving line TL3 and the fourth driving line TL4 simultaneously.In this case, the unit sensor may include one mutual capacitance formedat the intersection of two driving lines and two sensing lines. Fourmutual capacitances formed at the intersections of the two drivingelectrodes and the two sensing electrodes may be defined as a “secondunit sensor”.

The detector 332 receives voltages charged in the mutual capacitances ofthe sensor electrodes through the sensing lines under the control of thesensor controller 333. The detector 332 converts the voltages charged inthe mutual capacitances of the sensor electrodes received through thesensing lines into the detection data DD, which is digital data. Thedetector 332 may output the detection data DD to the main processor 710.

The sensor controller 333 may output a driving signal control signal VCSfor setting the first driving lines TL1 and the second driving linesTL2, to which the driving signal is to be output, to the driving signaloutput unit 331. The sensor controller 333 may output a sensing controlsignal DCS to the detector 332 to notify the reception timing of amountsof change in the mutual capacitances of the sensor electrodes.

The main processor 710 receives the detection data DD from the detector332. The main processor 710 may analyze the detection data DD andcalculate changes in the mutual capacitances in the second driving mode.The main processor 710 may calculate a user's touch coordinatesaccording to the amounts of change in the capacitance, and then executean application indicated by the icon touched by the user or perform theoperation. For example, when the amount of change in the mutualcapacitance of a first unit sensor is greater than a first thresholdvalue, the main processor 710 sets the coordinates of the first unitsensor as the coordinates of a user's touch in the second driving mode.For example, the main processor 710 may control the display device 10 sothat an application corresponding to an icon displayed on touchcoordinates is executed.

The main processor 710 receives the detection data DD from the detector332. The main processor 710 may determine the user's skin moisture byanalyzing the detection data DD in the first driving mode. For example,the main processor 710 may calculate the amounts of change in mutualcapacitances of the second unit sensors according to the detection dataDD. The main processor 710 may calculate a representative value obtainedby adding up the amounts of change in the mutual capacitances of thesecond unit sensors. The main processor 710 may include a first look-uptable that stores moisture data including information on a user's skinmoisture associated with the representative value. When the mainprocessor 710 outputs a representative value to the first look-up table,the main processor 710 may receive moisture data associated with therepresentative value from the first look-up table. The main processor710 may control the display device 10 so that information on a user'sskin moisture is displayed according to the moisture data.

FIG. 10 is a circuit diagram of a first driving electrode, a firstsensing electrode, a driving signal output unit, and a detector formutual capacitance sensing according to an exemplary embodiment. FIG. 10exemplarily shows only one mutual capacitance Cm formed between one ofthe driving electrodes TE connected to the driving lines, and one of thesensing electrodes connected to the sensing lines.

Referring to FIG. 10, a touch driving circuit 400 may include a drivingsignal output unit 331 and a detector 332. The detector 332 may includea voltage detector 3321 and an analog-to-digital converter 3322.

The driving signal output unit 331 outputs a driving signal to a drivingelectrode through a driving line. The driving signal may include aplurality of pulses.

The voltage detector 3331 detects the voltage charged in the mutualcapacitance through the sense line. The voltage detector 3321 mayinclude an operational amplifier OA1, a feedback capacitor C_(fb1), anda reset switch R_(SW1). The operational amplifier OA1 may include afirst input terminal (−), a second input terminal (+), and an outputterminal (out). The first input terminal (−) of the operationalamplifier OA1 may be connected to a first sense line RL1, the secondinput terminal (+) may be connected to an initialization voltage lineV_(REFL), from which an initialization voltage is supplied, and theoutput terminal (out) may be connected to the storage capacitor Cs1. Thefirst storage capacitor Cs1 is connected between the output terminal(out) and the ground to store the output voltage Vout1 from theoperational amplifier OA1. The feedback capacitor C_(fb1) and the resetswitch R_(SW1) may be connected in parallel between the first inputterminal (−) and the output terminal (out) of the operational amplifierOA1. The reset switch R_(SW1) controls the connection between both endsof the feedback capacitor C_(fb1). When the reset switch R_(SW1) isturned on, such that both ends of the feedback capacitor C_(fb1) areconnected, the feedback capacitor C_(fb1) may be reset.

The output voltage Vout1 from the operational amplifier OA1 may bedefined as in Equation 1 below:

$\begin{matrix}{{{Vout}\mspace{11mu} 1} = \frac{{Vcm} \times {Vt}\; 1}{{Cfb}\; 1}} & \left\lbrack {{Equation}\mspace{14mu} 1} \right\rbrack\end{matrix}$

In this case, Vout1 denotes the output voltage from the operationalamplifier OA1, Vcm denotes the mutual capacitance, C_(fb1) denotes thecapacitance of the feedback capacitor C_(fb1), and Vt1 denotes thevoltage charged in the mutual capacitance Cm.

The analog-to-digital converter 3322 may be connected to the storagecapacitor Cs1 through a switch SW1. The switch SW1 controls theconnection between the analog-to-digital converter 3322 and the storagecapacitor Cs1. Since the analog-to-digital converter 3322 is connectedto the storage capacitor Cs1 when the switch SW1 is turned on, theanalog-to-digital converter 3322 may convert the output voltage Vout1stored in the storage capacitor Cs1 into digital data, and output thedigital data.

FIG. 11 is an enlarged plan view of area A of FIG. 8 according to anexemplary embodiment.

Referring to FIG. 11, the sensing electrodes RE may be arranged in thefirst direction (e.g., x-axis direction) and electrically connected toone another. The driving electrodes TE may be arranged in the seconddirection (e.g., y-axis direction) and electrically connected to oneanother. The conductive patterns DE may be surrounded by the drivingelectrodes TE and the sensing electrodes RE, respectively.

The driving electrodes TE, the sensing electrodes RE, and the conductivepatterns DE may be electrically separated from each other. The drivingelectrodes TE, the sensing electrodes RE, and the conductive patterns DEmay be disposed apart from each other.

As shown in FIG. 10, the driving electrodes TE and the sensingelectrodes RE may have substantially the same size. The size of thedriving electrodes TE may be greater than that of the conductivepatterns DE. The size of the sensing electrodes RE may be greater thanthat of the conductive patterns DE. Although each of the drivingelectrodes TE, the sensing electrodes RE, and the conductive patterns DEhas a diamond shape when viewed from the top in FIG. 10, however, theinventive concepts are not limited thereto, and the shape of each of thedriving electrodes TE, the sensing electrodes RE, and the conductivepatterns DE may be varied.

In order to electrically separate the sensing electrodes RE from thedriving electrodes TE at their intersections, the driving electrodes TEadjacent to each other in the second direction (e.g., y-axis direction)may be connected through the first connection portions BE1, and thesensing electrodes RE adjacent to each other in the first direction(e.g., x-axis direction) may be connected through second connectionportions BE2.

The first connection portion BE1 may be formed on a different layer fromthe driving electrodes TE, and may be connected to the drivingelectrodes TE through the first contact holes CNT1. For example, thefirst connection portion BE1 may be formed in the first sensor electrodelayer TSL1, as shown in FIG. 13, and the driving electrodes TE may beformed in the second sensor electrode layer TSL2, as shown in FIG. 13.The second sensor electrode layer TSL2 may be disposed on the firstsensor electrode layer TSL1.

Each of the first connection portions BE1 may be bent at least once. InFIG. 11, the first connection portions BE1 are bent in the shape of “<”or “>”, but the shape of the first connection portions BE1 is notlimited thereto. In addition, since the driving electrodes TE adjacentto each other in the second direction (e.g., y-axis direction) areconnected by the plurality of first connection portions BE1, even if anyof the first connection portions BE1 is disconnected, the drivingelectrodes TE can still be stably connected with each other. Althoughtwo adjacent ones of the driving electrodes TE are illustrated as beingconnected by two first connection portions BE1 in FIG. 11, however, theinventive concepts are not limited thereto, and the number of firstconnection portions BE1 between adjacent driving electrodes TE may bevaried.

The second connection portion BE2 is formed on the same layer as thesensing electrodes RE, and may have a shape extended from the sensingelectrodes RE. The sensing electrodes RE and the second connectionportion BE2 may be formed of substantially the same material. Forexample, the sensing electrodes RE and the second connection portion BE2may be formed in the second sensor electrode layer TSL2, as shown inFIG. 14.

According to the illustrated exemplary embodiment shown in FIG. 10, thefirst connection portions BE1 connecting the driving electrodes TEadjacent to each other in the second direction (e.g., y-axis direction)may be formed in the first sensor electrode layer TSL1, while thedriving electrodes TE, the sensing electrodes RE, the conductivepatterns DE, and the second connection portions BE2 may be formed in thesecond sensor electrode layer TSL2 different from the first sensorelectrode layer TSL1. As such, the driving electrodes TE and the sensingelectrodes RE may be electrically separated from each other at theirintersections, while the sensing electrodes RE may be electricallyconnected with one another in the first direction (e.g., x-axisdirection), and the driving electrodes TE may be electrically connectedwith each other in the second direction (e.g., y-axis direction).

FIG. 12 is an enlarged plan view of area A-1 of FIG. 11 according to anexemplary embodiment.

Referring to FIG. 12, the driving electrodes TE, the sensing electrodesRE, the first connection portions BE1, and the second connectionportions BE2 may be formed in a mesh pattern. The conductive patterns DEmay also be formed in a mesh pattern. When the sensor electrode layerSEL including the driving electrodes TE and the sensing electrodes RE isformed directly on the thin-film encapsulation layer TFEL as shown inFIG. 5, the distance between the second electrode of the emissionmaterial layer EML and each of the driving electrodes TE and the sensingelectrodes RE of the layer TSL may become close. As such, a very largeparasitic capacitance may be formed between the second electrode of theemission material layer EML and the driving electrodes TE and thesensing electrodes RE of the sensor electrode light source SEL, becausethe parasitic capacitance is proportional to the area, where the secondelectrode of the emission material layer EML overlaps with each of thedriving electrodes TE and the sensing electrodes RE of the sensingelectrode layer SEL. As such, in order to reduce the parasiticcapacitance, each of the driving electrodes TE and the sensingelectrodes RE may be formed in a mesh pattern.

The driving electrodes TE, the sensing electrodes RE, the conductivepatterns DE, and the second connection portions BE2 are formed on thesame layer and may be spaced apart from each other. There may be a gapbetween the driving electrode TE and the sensing electrode RE, betweenthe driving electrode TE and the second connection portion BE2, betweenthe driving electrode TE and the conductive pattern DE, and between thesensing electrode RE and the conductive pattern DE. In FIG. 12, theboundary between the driving electrode TE and the sensing electrode RE,and the boundary between the driving electrode TE and the secondconnection portion BE2 are indicated by dashed lines.

The first connection portions BE1 may be connected to the drivingelectrodes TE through the first contact holes CNT1, respectively. Oneend of each of the first connection portions BE1 may be connected to oneof the driving electrodes TE adjacent to each other in the seconddirection (e.g., y-axis direction) through a first contact hole CNT1.The other end of each of the first connection portions BE1 may beconnected to another one of the driving electrodes TE adjacent to eachother in the second direction (e.g., y-axis direction) through a secondcontact hole CNT2. The first connection portions BE1 may overlap thedriving electrodes TE and the sensing electrode RE. Alternatively, thefirst connection portion BE1 may overlap the second connection portionBE2 instead of the sensing electrode RE. Still alternatively, the firstconnection portion BE1 may overlap the sensing electrode RE as well asthe second connection portion BE2. Since the first connection portionBE1 is formed on a different layer from the driving electrodes TE, thesensing electrodes RE, and the second connection portion BE2, ashort-circuit may be prevented in the sensing electrode RE and/or thesecond connection portion BE2 even when the first connection portion BE1overlaps the sensing electrode RE and/or the second connection portionBE2.

The second connection portion BE2 may be disposed between the sensingelectrodes RE. The second connection portion BE2 is formed on the samelayer as the sensing electrodes RE, and may be extended from each of thesensing electrodes RE. As such, the second connection portion BE2 may beconnected to the sensing electrodes RE without a separate contact hole.

Sub-pixels R, G, and B may include a first sub-pixel R emitting a firstcolor, a second sub-pixel G emitting a second color, and a thirdsub-pixel B emitting a third color. Although the first sub-pixel R isillustrated as a red sub-pixel, the second sub-pixel G is illustrated asa green sub-pixel, and the third sub-pixel B is illustrated as a bluesub-pixel in FIG. 12, however, the inventive concepts are not limitedthereto. In addition, although the first sub-pixel R, the secondsub-pixel G and the third sub-pixel B are illustrated as having ahexagonal shape when viewed from the top in FIG. 12, the inventiveconcepts are not limited thereto. For example, in some exemplaryembodiments, the first sub-pixel R, the second sub-pixel G, and thethird sub-pixel B may have a polygonal shape other than a hexagon, or acircular or elliptical shape when viewed from the top. In addition,while each the first sub-pixel R, the second sub-pixel G, and the thirdsub-pixel B is illustrated as having substantially the same size in FIG.12, however, the inventive concepts are not limited thereto. Forexample, in some exemplary embodiments, the third sub-pixel B may havethe largest size and the second sub-pixel G may have the smallest size.Alternatively, the size of the first sub-pixel R may be substantiallyequal to the size of the third sub-pixel B, and the size of the secondsub-pixel G may be less than the size of each of the first sub-pixel Rand the third sub-pixel B.

A pixel P refers to a group of sub-pixels capable of representinggrayscales. In the illustrated exemplary embodiment of FIG. 12, a pixelP includes a first sub-pixel R, two second sub-pixels G, and a thirdsub-pixel B. However, the inventive concepts are not limited thereto.For example, in some exemplary embodiments, a pixel P may include afirst sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3.

Since the driving electrodes TE, the sensing electrodes RE, theconductive patterns DE, the first connection portions BE1, and thesecond connection portions BE2 are formed in a mesh pattern, thesub-pixels R, G and B may not overlap the driving electrodes TE, thesensing electrodes RE, the conductive patterns DE, the first connectionportions BE1, and the second connection portions BE2. Accordingly, it ispossible to prevent a path of light output from the sub-pixels R, G, andB from being covered by the driving electrodes TE, the sensingelectrodes RE, the conductive patterns DE, the first connection portionsBE1, and the second connection portions BE2, which may reduce theluminance of light.

Area A-2 shown in FIG. 11 is substantially symmetrical to the area A-1,and thus, repeated descriptions of the area A-2 will be omitted.

FIG. 13 is a cross-sectional view taken along line II-II′ of FIG. 12.

Referring to FIG. 13, a thin-film transistor layer TFTL is formed on thesubstrate SUB. The thin-film transistor layer TFTL includes thin-filmtransistors 120, a gate insulating layer 130, an interlayer dielectriclayer 140, a protective layer 150, and a planarization layer 160.

A buffer film BF may be formed on a surface of the substrate SUB. Thebuffer film BF may be formed on one surface of the substrate SUB inorder to protect the thin-film transistors 120 and organic emittinglayer 172 of the light-emitting element layer EML from moisture, whichis likely to permeate through the substrate SUB. The buffer film BF maybe formed of a plurality of inorganic layers stacked one over another.For example, the buffer film BF may include one or more inorganiclayers, such as a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, and an aluminum oxidelayer, which may be alternately stacked one over another. In someexemplary embodiments, the buffer film BF may be omitted.

The thin-film transistors 120 are disposed on the buffer film BF. Eachof the thin-film transistor 120 includes an active layer 121, a gateelectrode 122, a source electrode 123, and a drain electrode 124. InFIG. 14, the thin-film transistors 120 are implemented as top-gatetransistors, in which the gate electrode 122 is located above the activelayer 121. However, the inventive concepts are not limited thereto. Forexample, in some exemplary embodiments, the thin-film transistors 210may be implemented as bottom-gate transistors, in which the gateelectrode 122 is located below the active layer 121, or as double-gatetransistors, in which the gate electrodes 122 are disposed above andbelow the active layer 121.

The active layer 121 is formed on the buffer layer BF. The active layer121 may include polycrystalline silicon, single crystal silicon,low-temperature polycrystalline silicon, amorphous silicon, or an oxidesemiconductor. The oxide semiconductor may include, for example, abinary compound (ABx), a ternary compound (ABxCy), and a quaternarycompound (ABxCyDz) including indium, zinc, gallium, tin, titanium,aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. Forexample, the active layer 121 may include an oxide including indium,tin, and titanium (ITZO) or an oxide including indium, gallium and tin(IGZO). In some exemplary embodiments, a light-blocking layer forblocking external light incident on the active layer 121 may be formedbetween the buffer layer BF and the active layer 121.

The gate insulating layer 130 may be formed on the active layer 121. Thegate insulating layer 130 may be formed of an inorganic layer, forexample, a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer. In FIG.14, the gate insulating layer 130 is illustrated as being formed on theentire buffer film BF irrespectively of the gate electrode 122, however,the inventive concepts are not limited thereto. For example, in someexemplary embodiments, the gate insulating layer 130 may be formed onlyover the gate electrode 122.

The gate electrodes 122 and gate lines may be formed on the gateinsulating layer 130. The gate electrodes 122 and the gate lines may bemade up of a single layer or multiple layers of one of molybdenum (Mo),aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni),neodymium (Nd), and copper (Cu), or an alloy thereof.

The interlayer dielectric layer 140 may be formed over the gateelectrodes 122 and the gate lines. The interlayer dielectric layer 140may be formed of an inorganic layer, for example, a silicon nitridelayer, a silicon oxynitride layer, a silicon oxide layer, a titaniumoxide layer, or an aluminum oxide layer.

The source electrodes 123 and the drain electrodes 124 may be formed onthe interlayer dielectric layer 140. Each of the source electrodes 123and the drain electrodes 124 may be connected to the active layer 121through a contact hole penetrating through the gate insulating layer 130and the interlayer dielectric layer 140. The source electrode 123 andthe drain electrode may be made up of a single layer or multiple layersof one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au),titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloythereof.

The protective layer 150 may be formed on the source electrode 213 andthe drain electrode 124 in order to insulate the thin-film transistors120. The protective layer 150 may be formed of an inorganic layer, forexample, a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer.

The planarization layer 160 may be formed on the protective layer 150 toprovide a flat surface over the step differences of the thin-filmtransistors 120. The planarization layer 160 may be formed of an organiclayer, such as an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin, and a polyimide resin.

The emission material layer EML is formed on the thin-film transistorlayer TFTL. The emission material layer EML includes light-emittingelements 170 and a bank layer 180.

The light-emitting elements 170 and the bank layer 180 are formed on theplanarization layer 160. Each of the light-emitting elements 170 mayinclude a first electrode 171, an organic emitting layer 172, and asecond electrode 173.

The first electrode 171 may be formed on the planarization layer 160.Although the first electrode 171 is illustrated as being connected tothe drain electrode 124 of the thin-film transistor 120 through thecontact hole penetrating through the protective layer 150 and theplanarization layer 160 in FIG. 14, however, the inventive concepts arenot limited thereto. The first electrode 171 may be connected to thesource electrode 123 of the thin-film transistor 120 through the contacthole penetrating through the protective layer 150 and the planarizationlayer 160.

In the top-emission organic light-emitting diode emitting light from theorganic emitting layer 172 toward the second electrode 173, the firstelectrode 171 may be made of a metal material having a highreflectivity, such as a stack structure of aluminum and titanium(Ti/Al/Ti), a stack structure of aluminum and ITO (ITO/Al/ITO), an APCalloy, and a stack structure of APC alloy and ITO (ITO/APC/ITO). The APCalloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

In the bottom-emission organic light-emitting diode emitting light fromthe organic emitting layer 172 toward the first electrode 171, the firstelectrode 171 may be formed of a transparent conductive material (TCP),such as ITO and IZO that can transmit light, or a semi-transmissiveconductive material, such as magnesium (Mg), silver (Ag), and an alloyof magnesium (Mg) and silver (Ag). In this case, when the firstelectrode 171 is made of a semi-transmissive metal material, the lightextraction efficiency can be increased by using microcavities.

The bank layer 180 may be formed to separate the first electrode 171from one another on the planarization layer 250 in order to define thesub-pixels R, G, and B. The bank layer 180 may be formed to cover theedge of the first electrode 171. The bank layer 180 may be formed of anorganic layer, such as an acryl resin, an epoxy resin, a phenolic resin,a polyamide resin, and a polyimide resin.

In each of the sub-pixels R, G, and B, the first electrode 171, theorganic emitting layer 172, and the second electrode 173 are stacked oneover another sequentially, so that holes from the first electrode 171and electrons from the second electrode 173 may be combined with eachother in the organic emitting layer 172 to emit light. The secondsub-pixel G and the third sub-pixel B may be formed substantially thesame as the first sub-pixel R shown in FIG. 13.

The organic emitting layer 172 is formed on the first electrode 171 andthe bank layer 180. The organic emitting layer 172 may include anorganic material and emit light of a certain color. For example, theorganic emitting layer 172 may include a hole transporting layer, anorganic material layer, and an electron transporting layer. In thiscase, the organic emitting layer 172 of the red sub-pixel R may emit redlight, the organic emitting layer 172 of the green sub-pixel G may emitgreen light, and the organic emitting layer 172 of the blue sub-pixel Bmay emit blue light.

Alternatively, the organic emitting layers 172 of the sub-pixels R, G,and B may be formed as a single layer to emit white light, ultravioletlight, or blue light. In this case, the red sub-pixel R may overlap ared color filter layer transmitting red light, the green sub-pixel G mayoverlap a green color filter layer transmitting green light, and theblue sub-pixel B may overlap a blue color filter layer transmitting bluelight. The red color filter layer, the green color filter layer, and theblue color filter layer may be disposed on the thin-film encapsulationlayer TFEL. In addition, in other exemplary embodiments, the redsub-pixel R may overlap a red wavelength conversion layer that convertsultraviolet light or blue light into red light, the green sub-pixel Gmay overlap a green wavelength conversion layer that convertsultraviolet light or blue light into green light, and the blue sub-pixelB may overlap a blue wavelength conversion layer that convertsultraviolet light or blue light into blue light. The red wavelengthconversion layer, the green wavelength conversion layer, and the bluewavelength conversion layer may be disposed on the thin-filmencapsulation layer TFEL. For example, the red wavelength conversionlayer may be disposed between the thin-film encapsulation layer TFEL andthe red color filter layer, the green wavelength conversion layer may bedisposed between the thin-film encapsulation layer TFEL and the greencolor filter layer, and the blue wavelength conversion layer may bedisposed between the thin-film encapsulation layer TFEL and the bluecolor filter layer.

The second electrode 173 is formed on the organic emitting layer 172.The second electrode 173 may be formed to cover the organic emittinglayer 172. The second electrode 173 may be a common layer formed acrossthe pixels P. A capping layer may be formed on the second electrode 173.

In the top-emission organic light-emitting diode, the second electrode173 may be formed of a transparent conductive material (TCP), such asITO and IZO that can transmit light, or a semi-transmissive conductivematerial, such as magnesium (Mg), silver (Ag), and an alloy of magnesium(Mg) and silver (Ag). When the second electrode 173 is formed of atransflective metal material, the light extraction efficiency can beincreased by using microcavities.

In the bottom-emission organic light-emitting diode, the secondelectrode 173 may be made of a metal material having a highreflectivity, such as a stack structure of aluminum and titanium(Ti/Al/Ti), a stack structure of aluminum and ITO (ITO/Al/ITO), an APCalloy, and a stack structure of APC alloy and ITO (ITO/APC/ITO). Asdescribed above, the APC alloy may be an alloy of silver (Ag), palladium(Pd), and copper (Cu).

The thin-film encapsulation layer TFFL is formed on the light-emittingelement layer EML. The thin-film encapsulation layer TFEL is disposed onthe second electrode 173. The thin-film encapsulation layer TFEL mayinclude at least one inorganic layer to prevent oxygen or moisture frompermeating into the organic emitting layer 172 and the second electrode173. In addition, the thin-film encapsulation layer TFEL may include atleast one organic layer to protect the emission material layer EML fromparticles, such as dust. For example, the thin-film encapsulation layerTFEL may include a first inorganic layer disposed on the secondelectrode 173, an organic layer disposed on the first inorganic layer,and a second inorganic layer disposed on the organic layer. The firstinorganic layer and the second inorganic layer may be formed of, but isnot limited to, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.The organic layer may be formed of, but is not limited to, an acrylresin, an epoxy resin, a phenolic resin, a polyamide resin, and apolyimide resin.

The sensor electrode layer SEL is formed on the thin-film encapsulationlayer TFEL. A buffer layer may be further formed between the thin-filmencapsulation layer TFEL and the sensor electrode layer SEL. The sensorelectrode layer SEL may include a first sensor electrode layer TSL1 anda second sensor electrode layer TSL2. FIG. 13 shows only the drivingelectrode TE, the sensing electrode RE, and the first connection portionBE1 of the sensor electrode layer SEL.

The first sensor electrode layer TSL1 is formed on the thin-filmencapsulation layer TFEL. The first sensor electrode layer TSL1 mayinclude first connection portions BE1. The first sensor electrode layerTSL1 may be made up of, but is not limited to, a stack structure ofaluminum and titanium (Ti/Al/Ti), a stack structure of aluminum and ITO(ITO/Al/ITO), an APC alloy, and a stack structure of APC alloy and ITO(ITO/APC/ITO).

A first touch insulating layer TINS1 is formed on the first sensorelectrode layer TSL1. The first touch insulating layer TINS1 may beformed of an inorganic layer, for example, a silicon nitride layer, asilicon oxynitride layer, a silicon oxide layer, a titanium oxide layer,or an aluminum oxide layer. Alternatively, the first touch insulatinglayer TINS1 may be formed of an organic layer, such as an acryl resin,an epoxy resin, a phenolic resin, a polyamide resin, and a polyimideresin.

The second sensor electrode layer TSL2 is formed on the first touchinsulating layer TINS1. The second sensor electrode layer TSL2 mayinclude the driving electrodes TE, the sensing electrodes RE, theconductive patterns DE, the first connection portions BE1, the secondconnection portions BE2, and the first group of driving lines GTL1, thesecond group of driving lines GTL2, the sensing lines RL, the guardlines GL1, GL2, GL3, GL4 and GL5, and the ground lines GRL1, GRL2, GRL3and GRL4. The second sensor electrode layer TSL2 may be made up of, butis not limited to, a stack structure of aluminum and titanium(Ti/Al/Ti), a stack structure of aluminum and ITO (ITO/Al/ITO), an APCalloy, and a stack structure of APC alloy and ITO (ITO/APC/ITO).

First contact holes CNT1 may be formed through the first touchinsulating layer TINS1, via which the first connection portions BE1 areexposed. The driving electrodes TE may be connected to the firstconnection portions BE1 through the first contact holes CNT1.

A second touch insulating layer TINS2 is formed on the second sensorelectrode layer TSL2. The second touch insulating layer TINS2 mayprovide a flat surface over the level difference created by the firstsensor electrode layer TSL1 and the second sensor electrode layer TSL2.The second touch insulating layer TINS2 may be formed of an organiclayer, such as an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin, and a polyimide resin.

According to the illustrated exemplary embodiment shown in FIG. 13, thefirst connection portions BE1 connecting the driving electrodes TEadjacent to each other in the second direction (e.g., y-axis direction)may be formed in the first sensor electrode layer TSL1, while thedriving electrodes TE, the sensing electrodes RE, and the secondconnection portions BE2 may be formed in the second sensor electrodelayer TSL2 different from the first sensor electrode layer TSL1. Assuch, the driving electrodes TE and the sensing electrodes RE may beelectrically separated from each other at their intersections, while thesensing electrodes RE may be electrically connected with one another inthe first direction (e.g., x-axis direction), and the driving electrodesTE and proximity sensing electrodes PE may be electrically connectedwith each other in the second direction (e.g., y-axis direction).

FIG. 14 is a flowchart for illustrating a touch sensing scheme by asensor unit in a second driving mode according to an exemplaryembodiment.

Referring to FIG. 14, the driving signal output unit 331 applies drivingsignals to the first R driving lines TL1 and TL2, to the second Rdriving lines, and so on. The detector 332 detects voltages charged inthe mutual capacitances through the sensing lines RL, and converts thevoltages charged in the mutual capacitances sensed by the first Ssensing lines, by the second S sensing lines, and so on, into detectiondata, which may be digital data. As used herein, the voltage of themutual capacitance detected by the detector 332 may be referred to as adetection signal (steps S101 and S102 of FIG. 14).

The driving signal output unit 331 applies driving signals to the firstR driving lines TL1 to TL4, to the second R driving lines, and so on,according to the driving signal control signal VCS in the second drivingmode. For example, as shown in FIG. 15, in the second driving mode, thedriving signal output unit 331 may apply a driving signal to a firstdriving line TL1, then a driving signal to a first driving line TL2,then a driving signal to a first driving line TL3, and then a drivingsignal to a first driving line TL4.

The detector 332 detects the voltages charged in the mutual capacitancesof every S sensing lines according to a sensing control signal DCS inthe second driving mode. The detector 332 converts the detected voltagescharged in the mutual capacities received through the sensing lines intothe detection data DD, which is digital data. In this case, the mutualcapacitance(s) formed at the intersection(s) of the R driving electrodesand S sensing electrodes may be defined as a first unit sensor. Inparticular, the voltage(s) charged in the R-by-S mutual capacitance(s)of a first unit sensor may be calculated as one detection data DD by thedetector 332.

For example, the driving signal output unit 331 may sequentially applydriving signals to the driving lines one-by-one in the second drivingmode as shown in FIG. 15. The detector 332 may detect the voltagecharged in the mutual capacitances of the sensing lines one-by-one inthe second driving mode. In this case, the mutual capacitance formed atthe intersection of one driving electrode and one sensing electrode maybe defined as a first unit sensor. In particular, the voltage charged inone mutual capacitance of a first unit sensor may be calculated as onedetection data DD by the detector 332. In FIG. 15, each of the first tosixteenth mutual capacitances C_(m1) to C_(m16) may be defined as oneunit sensor.

Then, the detection data DD is analyzed to determine whether there is auser's touch (step S103 of FIG. 14).

The main processor 710 receives the detection data DD from the detector332. The main processor 710 may analyze the detection data DD andcalculate changes in the mutual capacities in the second driving mode.The main processor 710 may calculate a user's touch coordinatesaccording to the amounts of change in the mutual capacitances, and thenexecute an application indicated by the icon touched by the user orperform the operation. For example, when the amount of change in themutual capacitance of a first unit sensor calculated based on thedetection data DD is greater than a first threshold value, the mainprocessor 710 sets the coordinates of the first unit sensor as thecoordinates of a user's touch in the second driving mode. For example,the main processor 710 may control the display device 10 so that anapplication indicated by an icon displayed on touch coordinates isexecuted.

FIG. 16 is a flowchart for illustrating a touch sensing scheme by asensor unit in a first driving mode according to an exemplaryembodiment.

Referring to FIG. 16, the driving signal output unit 331 applies drivingsignals to every P driving lines TL1 and TL2. The detector 332 detectsvoltages charged in the mutual capacitances of every Q sensing linesthrough the sensing lines RL, and converts the voltages charged in themutual capacitances into detection data, which may be digital data. Asused herein, the voltage of the mutual capacitance detected by thedetector 332 may be referred to as a detection signal (steps S201 andS202 of FIG. 16).

The driving signal output unit 331 applies driving signals to every Pdriving lines TL1 to TL2 according to the driving signal control signalVCS in the first driving mode. For example, in the first driving mode,the driving signal output unit 331 may apply a driving signal to thefirst driving line TL1 and the second driving line TL2 simultaneously,and then may apply a driving signal to the third driving line TL3 andthe fourth driving line TL4 simultaneously.

The detector 332 detects the voltages charged in the mutual capacitancesof every Q sensing lines according to a sensing control signal DCS inthe first driving mode. The detector 332 converts the detected voltagescharged in the mutual capacities received through the sensing lines intothe detection data DD, which may be digital data. In this case, themutual capacitance(s) formed at the intersection(s) of the P drivingelectrodes and Q sensing electrodes may be defined as a second unitsensor. In particular, the amounts of change(s) in the P-by-Q mutualcapacitance(s) of a second unit sensor may be calculated as onedetection data DD by the detector 332.

When the mutual capacitances of the second unit sensor has a greatervalue, the amounts of change in the mutual capacitances of the secondunit sensor may also have a greater value according to a person's skinmoisture. As such, the mutual capacitances of the second unit sensor maybe greater than that of the first unit sensor. Accordingly, thedetection data DD calculated by the mutual capacitances of the secondunit sensor may be greater than the detection data DD calculated by themutual capacitances of the first unit sensor.

For example, the driving signal output unit 331 may sequentially applydriving signals to the driving lines two-by-two in the first drivingmode, as shown in FIG. 17. The detector 332 may receive the amounts ofchange in the mutual capacitances of every two sensing lines in thefirst driving mode. In this case, the mutual capacitance formed at theintersections of the two driving electrodes and the two sensingelectrodes may be defined as a second unit sensor. In particular, theamounts of change in four mutual capacitances of a second unit sensormay be calculated as one detection data DD by the detector 332.

Then, the detection data DD is analyzed to calculate the user's skinmoisture (step S204 of FIG. 16).

The main processor 710 receives the detection data DD from the detector332. The main processor 710 may determine the user's skin moisture byanalyzing the detection data DD in the first driving mode. For example,the main processor 710 may calculate the amounts of change in mutualcapacitances of the second unit sensors according to the detection dataDD. The main processor 710 may calculate a representative value obtainedby adding up the amounts of change in the mutual capacitances of thesecond unit sensors. The main processor 710 may include a first look-uptable that stores moisture data including information on a user's skinmoisture associated with the representative value. When the mainprocessor 710 outputs a representative value to the first look-up table,the main processor 710 may receive moisture data associated with therepresentative value from the first look-up table. The main processor710 may control the display device 10 so that information on a user'sskin moisture is displayed according to the moisture data.

According to the illustrated exemplary embodiment shown in FIG. 16, thenumber of mutual capacitances of the second unit sensor in the firstdriving mode is greater than the number of mutual capacitances of thefirst unit sensor in the second driving mode, so that the mutualcapacitances of the second unit sensor can be greater than the mutualcapacitances of the first unit sensor. In this manner, the differencebetween the amounts of change in mutual capacitances of the second unitsensor may become larger according to a person's skin moisture, so thatthe skin moisture can be measured.

FIG. 18 is a graph showing the amount of change in the total mutualcapacitance according to the frequency of the driving signal in thefirst driving mode.

In the graph shown in FIG. 18, the x-axis represents the frequency (kHz)of the driving signal, and the y-axis represents the representativevalue ΔC_(ap) calculated based on the detection data DD. Therepresentative value may be the sum of amounts of change in the mutualcapacitances of the second unit sensors.

Referring to FIG. 18, when the frequency of the driving signal rangesfrom about 50 kHz to about 500 kHz in the first driving mode, there maybe a difference in the representative value ΔC_(ap) between a dry skinand a wet skin. On the other hand, when the frequency of the drivingsignal is greater than about 500 kHz, there is almost no difference inthe representative value ΔC_(ap) between the dry skin and the wet skin.As such, the frequency of the driving signal output from the drivingsignal output unit 331 in the first driving mode may range from about 50kHz to about 500 kHz.

The driving signal output unit 331 may output the driving signal at afirst frequency in the second driving mode, and may output the drivingsignal at a second frequency in the first driving mode. For example, thefirst frequency may be about 200 kHz, and the second frequency may beabout 50 kHz to about 500 kHz.

Since the first frequency is in the range of the second frequency, thedriving signal output unit 331 may output the driving signal at the samefrequency in the second driving mode and the first driving mode in orderto simplify the driving method.

In addition, the difference in the representative value ΔC_(ap) betweenthe dry skin and the wet skin is larger when the second frequency isabout 50 kHz to about 100 kHz than when the second frequency is about100 kHz to about 500 kHz. As such, in order to increase the accuracy inmeasuring the skin moisture, the driving signal output unit 331 mayoutput the driving signal at a frequency of about 50 kHz to about 500kHz in the first driving mode. In this case, the driving signal outputunit 331 may output the driving signals at different frequencies betweenthe second driving mode and the first driving mode.

FIG. 19 is a graph showing the amounts of change in the total mutualcapacitances over time for different experimenters in the first drivingmode.

In the graph shown in FIG. 19, the x-axis represents the frequency (kHz)of the driving signal, and the y-axis represents the representativevalue ΔC_(ap) calculated based on the detection data DD. Therepresentative value may be the sum of amounts of change in the mutualcapacitances of the second unit sensors.

Referring to FIG. 19, there may be differences in time period until therepresentative value ΔC_(ap) is saturated depending on the persons'skins. For example, in the experimenter A, the representative valueΔC_(ap) is hardly changed, whereas for the experimenter B and theexperimenter C, the representative value ΔC_(ap) may be saturated afterapproximately 1,500 ms, i.e., about 1.5 seconds.

The time period until the representative value ΔC_(ap) is saturated at90% may be approximately 1,000 ms, that is, approximately 1 second. Evenwhen the representative value ΔC_(ap) is saturated at 90%, the skinmoisture can be calculated based on the representative value ΔC_(ap).Therefore, the time period, during which the driving signal is appliedin the first driving mode, may be approximately 1 second to 1.5 seconds.Accordingly, the driving signal output unit 311, in the first drivingmode, may sequentially apply driving signals to the first P drivinglines, to the second P driving lines, and so on, for approximately 1second or 1.5 second repeatedly. As such, the time period in which thedriving signals are sequentially applied to the first P driving lines,to the second P driving lines, and so on in the first driving mode maybe longer than the time period in which the driving signals aresequentially applied to the first R driving lines, to the second Rdriving lines, and so on in the second driving mode.

FIG. 20 is a graph showing skin moisture content versus capacitance oftotal mutual capacitance.

In the graph shown in FIG. 20, the x-axis represents the representativevalue ΔC_(ap), and the y-axis represents the skin moisture content (%).The skin moisture content may be expressed from 0 to 100%. Therepresentative value may be the sum of amounts of change in mutualcapacitances of the second unit sensors.

Referring to FIG. 20, the representative value ΔC_(ap) is proportionalto the skin moisture content. In particular, the larger therepresentative value ΔC_(ap) is, the higher the skin moisture contentis, and vice versa.

Human skin includes the stratum corneum, epidermis, and dermis, as shownin FIG. 21. The stratum corneum is exposed to the outside. The epidermisis located under the stratum corneum. The dermis is located under theepidermis. The stratum corneum includes keratinocyte and intercellularlipid, as shown in FIG. 22. The keratinocyte may include naturalmoisture factor. Intercellular lipids may include ceramides, fattyacids, cholesterol, etc. The moisture content of the stratum corneum mayvary depending on the natural moisture factor.

Since the dielectric constant of water is greater than that ofcholesterol, ceramide, etc., the higher the moisture content of thestratum corneum is, the greater the capacitance value of a person is,and vice versa. As such, as shown in FIG. 20, the capacitance value of aperson increases with the skin moisture content of the person, and thus,the representative value ΔC_(ap) may be increased.

According to the illustrated exemplary embodiment shown in FIG. 20, therepresentative value ΔC_(ap) may be calculated based on the detectiondata DD in the first driving mode, and the moisture content of aperson's skin may be calculated based on the representative valueΔC_(ap).

FIG. 23 is a flowchart for illustrating a touch sensing scheme by asensor unit in a first driving mode according to an exemplaryembodiment.

The touch sensing scheme illustrated in FIG. 23 is different from thatshown in FIG. 16, in that step S303 is added. Since steps S301, S302,and S303 of FIG. 23 are substantially identical to steps S201, S202 andS203 of FIG. 16, and thus, repeated descriptions thereof will beomitted.

Referring to FIG. 23, the main processor 710 may receive the detectiondata DD from the detector 332, and may determine the user's skinmoisture by analyzing the detection data DD in the first driving mode.In doing so, after correcting the detection data DD according to the useenvironment of the display device 10 in step S303, the user maydetermine the user's skin moisture by analyzing the detection data DD.For example, the main processor 710 may correct the detection data DD inconsideration of temperature and humidity, as shown in FIG. 24.Alternatively, the main processor 710 may correct the detection data DDbased on whether there a protective film, as illustrated in FIG. 25.Still alternatively, the main processor 710 may correct the detectiondata DD by determining whether the display device 10 is in contact witha ground mass, such as the ground and an object, as illustrated in FIG.26.

FIG. 24 is a flowchart illustrating step S303 of FIG. 23 according to anexemplary embodiment.

Referring to FIG. 24, the main processor 710 may acquire temperatureinformation and humidity information. For example, the temperatureinformation and humidity information of the current location may beautomatically transmitted from the Meteorological Agency throughwireless communications with the Global Positioning System (GPS) when askin moisture measurement application is run. Alternatively, thetemperature information and humidity information of the current locationmay be manually input by the user when the skin moisture measurementapplication is run (step S401 in FIG. 24).

The main processor 710 then determines whether the temperature lieswithin a predetermined temperature range. For example, the predeterminedtemperature range may be about 5° C. to about 35° C., which is the roomtemperature. The main processor 710 corrects the sensed data DD when thetemperature gets out of the predetermined temperature range. Forexample, when the temperature is lower than the lower limit of thepredetermined temperature range, the detection data DD may be smallerthan when the temperature is included in the predetermined temperaturerange, and thus, the main processor 710 may correct the detection dataDD by incrementing it. In addition, when the temperature is lower thanthe upper limit of the predetermined temperature range, the detectiondata DD may be larger than when the temperature is included in thepredetermined temperature range, and thus the main processor 710 maycorrect the detection data DD by reducing the detection data DD.

The main processor 710 may include a second look-up table that storesthe corrected detection data based on the temperature and the detectiondata. The main processor 710 may correct the sensed data DD using thesecond look-up table (steps S402 and S403 of FIG. 24).

Then, the main processor 710 determines whether the temperature lieswithin a predetermined humidity range. For example, the predeterminedhumidity range may range from about 40% to about 60%. The main processor710 corrects the detection data DD when the humidity is out of thepredetermined humidity range. For example, when the humidity is lowerthan the lower limit of the predetermined humidity range, the detectiondata DD may be smaller than when the humidity is included in thepredetermined humidity range, and thus, the main processor 710 maycorrect the detection data DD by increasing the detection data DD. Inaddition, when the humidity is lower than the upper limit of thepredetermined humidity range, the detection data DD may be larger thanwhen the humidity is included in the predetermined humidity range, andthus, the main processor 710 may correct the detection data DD byreducing the detection data DD.

The main processor 710 may include a third look-up table that stores thecorrected detection data based on the humidity and the detection data.The main processor 710 may correct the detection data DD using the thirdlook-up table (steps S404 and S405 of FIG. 24).

According to the illustrated exemplary embodiment shown in FIG. 24, auser's skin moisture can be more accurately determined by correcting thedetection data DD based on the temperature and humidity according to theuser's location.

FIG. 25 is a flowchart illustrating the step S303 of FIG. 23 accordingto another exemplary embodiment.

Referring to FIG. 25, the main processor 710 may acquire information onwhether a protective film is attached to the cover window 100. Forexample, a user may manually input whether or not the protective film isattached when a skin moisture measurement application is run (step S501of FIG. 25).

If the protective film is attached to the cover window 100, the mainprocessor 710 corrects the detection data DD. For example, when theprotective film is attached to the cover window 100, a user's the skinmoisture is blocked by the protective film, and thus, the detection dataDD may be smaller than that when the protective film is not attached.Therefore, the main processor 710 may correct the detection data DD byincreasing the detection data DD when a protective film is attached onthe cover window 100.

The main processor 710 may include a fourth look-up table that storesthe corrected detection data associated with the detection data. Themain processor 710 may correct the detection data DD using the fourthlook-up table (step S502 of FIG. 25).

According to the illustrated exemplary embodiment shown in FIG. 25, auser's skin moisture can be more accurately determined by correcting thedetection data DD based on whether a protective film is attached on thecover window 100.

FIG. 26 is a flowchart illustrating the step S303 of FIG. 23 accordingto another exemplary embodiment.

Referring to FIG. 26, the main processor 710 determines whether thedisplay device 10 is in contact with a ground mass, such as the groundand an object. The main processor 710 may determine the inclination ofthe display device 10 and the rotation direction of the display device10 based on the acceleration data from the acceleration sensor 740 andthe angular velocity data from the gyro sensor 750. Therefore, the mainprocessor 710 can determine whether the display device 10 is stationarybased on the acceleration data and the angular velocity data. The mainprocessor 710 may determine that the display device 10 is supported by aground mass, such as the ground and an object, when the user measuresskin moisture while the display device 10 is stationary (S601 in FIG.26).

Then, when it is determined that the display device 10 is supported by aground mass, such as the ground and an object, the main processor 710corrects the detection data DD. For example, when it is determined thatthe display device 10 is supported by a ground mass, such as the groundand an object, the capacitances of the sensor electrodes are affected bythe ground mass. Therefore, the detection data DD may be smaller thanthat when the display device 10 is not supported by the ground mass. Assuch, the main processor 710 may correct the detection data DD byincreasing the detection data DD when a protective film is attached onthe cover window 100.

The main processor 710 may include a fifth look-up table that stores thecorrected detection data associated with the detection data. The mainprocessor 710 may correct the detection data DD using the fifth look-uptable (step S602 of FIG. 26).

According to the illustrated exemplary embodiment illustrated in FIG.26, the user's skin moisture may be more accurately determined bycorrecting the detection data DD depending on whether the display device10 is supported by a ground mass, such as the ground or an object.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, the number of mutualcapacitances of the second unit sensor in the first driving mode may begreater than the number of mutual capacitances of the first unit sensorin the second driving mode, so that the capacitance of the mutualcapacitances of the second unit sensor may be greater than thecapacitance of mutual capacitances of the first unit sensor. In thismanner, the difference between the amounts of change in mutualcapacitances of the second unit sensors can become larger according to aperson's skin moisture, so that the skin moisture can be measured moreaccurately.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, the frequency of thedriving signal is controlled to be in a range from about 50 kHz to about500 kHz, so that differences between the amounts of change in mutualcapacitances of second unit sensors on a dry skin and the amounts ofchange in mutual capacitances of second unit sensors on a wet skin in afirst driving mode can become larger. In this manner, a person's skinmoisture may be measured more accurately.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, driving signals areapplied sequentially to every P driving lines for approximately 1 to 1.5seconds repeatedly in a first driving mode, so that differences betweenthe amounts of change in mutual capacitances of second unit sensors ondifferent person's skins can become larger. In this manner, a person'sskin moisture may be measured more accurately.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, it is possible to moreaccurately determine a user's skin moisture by correcting the detectiondata based on the temperature and humidity according to the user'slocation.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, it is possible todetermine more accurately a user's skin moisture by correcting thedetection data based on whether a protective film is attached on a coverwindow.

In a sensor unit, a display device including the sensor unit, and amethod for measuring moisture using the sensor unit constructedaccording to one or more exemplary embodiments, it is possible todetermine more accurately a user's skin moisture by correcting thedetection data based on whether a display device is supported by aground mass such as the ground and an object.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A sensor unit comprising: driving electrodes andsensing electrodes; driving lines connected to the driving electrodes;sensing lines connected to the sensing electrodes; a driving signaloutput unit configured to sequentially apply driving signals to every Pdriving lines in a first driving mode, wherein P is a positive integer;and a detector configured to receive detection signals from every Qsensing lines in the first driving mode, wherein Q is a positiveinteger, wherein the first driving mode is for calculating a skinmoisture content.
 2. The sensor unit of claim 1, wherein P is greaterthan Q.
 3. The sensor unit of claim 1, wherein P is equal to Q.
 4. Thesensor unit of claim 1, wherein, in the first driving mode, the drivingsignal output unit is configured to apply the driving signalssimultaneously to each of the P driving lines.
 5. The sensor unit ofclaim 4, wherein, in the first driving mode, the driving signal outputunit is configured to apply the driving signals sequentially to every Pdriving lines for 1 to 1.5 seconds repeatedly.
 6. The sensor unit ofclaim 1, wherein, in the first driving mode, the detector is configuredto convert the detection signals into digital detection data, and outputthe digital detection data.
 7. The sensor unit of claim 1, wherein, inthe first driving mode, a frequency of the driving signal is in a rangeof about 50 kHz to about 500 kHz.
 8. The sensor unit of claim 1,wherein: the driving signal output unit is configured to apply thedriving signals sequentially to every R driving lines in a seconddriving mode, wherein R is a positive integer less than P; and thedetector is configured to receive the detection signals from S sensinglines in the second driving mode, wherein S is a positive integer lessthan Q, wherein the second driving mode is for detecting a touch.
 9. Thesensor unit of claim 8, wherein R is less than P, and S is less than Q.10. The sensor unit of claim 8, wherein a time period during which thedriving signals are sequentially applied to every P driving lines in thefirst driving mode is longer than a time period during which the drivingsignals are sequentially applied to every R driving lines in the seconddriving mode.
 11. The sensor unit of claim 10, wherein a frequency ofthe driving signal in the first driving mode is different from afrequency of the driving signal in the second driving mode.
 12. Thesensor unit of claim 10, wherein a frequency of the driving signal inthe first driving mode is equal to a frequency of the driving signal inthe second driving mode.
 13. A display device comprising: a displaypanel including: a display unit configured to display images; and asensor unit configured to measure a skin moisture content, the sensorunit comprising: sensor electrodes including driving electrodes andsensing electrodes; driving lines connected to the driving electrodes;sensing lines connected to the sensing electrodes; a driving signaloutput unit configured to sequentially apply driving signals to every Pdriving lines in a first driving mode, wherein P is a positive integer;and a detector configured to receive detection signals from every Qsensing lines in the first driving mode, wherein Q is a positiveinteger, wherein the first driving mode is for calculating a skinmoisture content.
 14. The display device of claim 13, further comprisinga main processor, wherein: the detector is configured to convert thedetection signals into digital detection data and output the digitaldetection data in the first driving mode; and the main processor isconfigured to calculate a skin moisture content based on the digitaldetection data.
 15. The display device of claim 14, wherein the mainprocessor is configured to output skin moisture data including skinmoisture content information according to the digital detection data.16. The display device of claim 14, wherein the main processor isconfigured to correct the digital detection data before calculating theskin moisture content according to the digital detection data.
 17. Thedisplay device of claim 14, wherein the main processor is configured tocorrect the digital detection data when at least one of a temperature isnot in a predetermined temperature range and a humidity is not in apredetermined humidity range.
 18. The display device of claim 17,wherein: the corrected digital detection data has a greater value thanthe digital detection data when the temperature is lower than a lowerlimit of the predetermined temperature range; and the corrected digitaldetection data has a lower value than the digital detection data whenthe temperature is higher than an upper limit of the predeterminedtemperature range.
 19. The display device of claim 14, wherein the mainprocessor is configured to increase the digital detection data when aprotective film is disposed on the display panel.
 20. The display deviceof claim 19, wherein the main processor is configured to increase thedigital detection data when the display panel is determined as beingstationary.
 21. A method of measuring moisture by a sensor unit, themethod comprising: sequentially applying driving signals to every Pdriving lines, and receiving detection signals from every Q sensinglines, wherein P and Q are positive integers; converting the detectionsignals into digital detection data; and calculating a skin moisturecontent based on the digital detection data, wherein the skin moisturecontent increases as the digital detection data decreases.
 22. Themethod of claim 21, further comprising correcting the digital detectiondata when at least one of a temperature is not in a predeterminedtemperature range and a humidity does is not in a predetermined humidityrange.
 23. The method of claim 22, wherein the digital detection data iscorrected to have a greater value when the temperature is lower than alower limit of the predetermined temperature range, and the digitaldetection data is corrected to have a lower value when the temperatureis higher than an upper limit of the predetermined temperature range.24. The method of claim 21, further comprising increasing the digitaldetection data when a protective film is disposed on a display panel.25. The method of claim 21, further comprising increasing the digitaldetection data if it is determined that a display panel is supported bya ground mass, such as a ground and an object.